• DocumentCode
    140424
  • Title

    Estimation of pedicle screw fixation strength from probe indentation force and screw insertion torque: A biomechanical study on bone surrogates of various densities

  • Author

    Mehmanparast, H.N. ; Mac-Thiong, J.M. ; Petit, Y.

  • Author_Institution
    Mech. Eng. Dept., Ecole de Technol. Super., Montreal, QC, Canada
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    4350
  • Lastpage
    4353
  • Abstract
    Posterior pedicle screw fixation is commonly used for patients with spinal disorders. However, failure of fixation is reported in many cases and surgeons have only little information. The objective of this study was to assess the correlation between the probe indentation force, screw insertion torque and the pullout force using bone surrogates of different densities. The indentation force and insertion torque were measured using a custom made test bench during screw insertion into polyurethane foam blocks. The two variables were significantly correlated to pullout force and to density. A high correlation was also found between indentation force and the peak insertion torque. The proposed methods for measuring indentation force and screw insertion torque were reproducible. This study suggests that the peak screw insertion torque and the indentation force can predict the screw fixation strength in synthetic bone models. Additional tests should be performed on animal and human specimens to confirm and to translate these findings to clinical applications.
  • Keywords
    biomechanics; biomedical materials; biomedical measurement; bone; indentation; biomechanical study; bone surrogates; peak screw insertion torque; pedicle screw fixation strength estimation; polyurethane foam blocks; probe indentation force; synthetic bone models; Bones; Fasteners; Fixtures; Force; Force measurement; Torque; Torque measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6944587
  • Filename
    6944587