DocumentCode
1406393
Title
Packaging design of microsystems and meso-scale devices
Author
Hsu, Tai-Ran
Author_Institution
Dept. of Mech. & Aerosp. Eng., San Jose State Univ., CA, USA
Volume
23
Issue
4
fYear
2000
fDate
11/1/2000 12:00:00 AM
Firstpage
596
Lastpage
601
Abstract
This paper will present an overview on electromechanical packaging of microelectromechanical systems (MEMS) and microsystems such as microsensors, actuators, and fluidics. Technical problems and major issues related to packaging design will also be presented and discussed.
Keywords
micromechanical devices; semiconductor device packaging; electromechanical packaging; meso-scale devices; microactuators; microelectromechanical systems; microfluidics; microsensors; microsystems; packaging design; Actuators; Costs; Electromechanical sensors; Fabrication; Fluidics; Microelectromechanical systems; Micromechanical devices; Microsensors; Packaging; Signal processing;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.883747
Filename
883747
Link To Document