Characterization of a planar spiral inductor on a composite-resin low-impedance substrate and its application to microwave circuits

Author

Okabe, Hiroshi ; Yamada, Hiroji ; Yamasaki, Matsuo ; Kagaya, Osamu ; Sekine, Kenji ; Yamashita, Kiichi

Author_Institution

Central Res. Lab., Hitachi Ltd., Tokyo, Japan

Volume

21

Issue

3

fYear

1998

fDate

8/1/1998 12:00:00 AM

Firstpage

269

Lastpage

273

Abstract

The Q-factors of planar spiral inductors built on a polyimide-SiO ₂-Si substrate are characterized as a function of the polyimide thickness. We found that inductor quality as high as that on a GaAs-microwave and millimeter-wave integrated circuit (MMIC) requires a polyimide thickness of over 100 μm, resulting in a Q-factor of over 17. The applicability of a low-impedance substrate was confirmed through the investigation of a novel RF-MCM in a face-up-type structure for cellular phone systems using a composite epoxy resin-metallic substrate. A fabricated power amplifier module exhibited 28.5-dBm output power and 16% power efficiency at 1.75 GHz

Keywords

Q-factor; composite materials; electric impedance; inductors; microwave power amplifiers; multichip modules; polymer films; substrates; 1.75 GHz; 16 percent; Q-factor; cellular phone; composite epoxy resin-metallic substrate; face-up-type RF-MCM; low-impedance substrate; microwave circuit; planar spiral inductor; polyimide-SiO₂-Si substrate; power amplifier; Cellular phones; Conductors; Gallium arsenide; Impedance; Inductors; Insulation; Microwave circuits; Polyimides; Power amplifiers; Spirals;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.704937

Filename

704937