• DocumentCode
    1409037
  • Title

    Electrical Test Structures for the Characterization of Optical Proximity Correction

  • Author

    Tsiamis, Andreas ; Smith, Stewart ; McCallum, Martin ; Hourd, Andrew ; Stevenson, Tom ; Walton, Anthony J.

  • Author_Institution
    Inst. for Integrated Micro & Nano Syst., Univ. of Edinburgh, Edinburgh, UK
  • Volume
    25
  • Issue
    2
  • fYear
    2012
  • fDate
    5/1/2012 12:00:00 AM
  • Firstpage
    162
  • Lastpage
    169
  • Abstract
    Resistive electrical test structures have been designed to enable the characterization of optical proximity correction (OPC) applied to a right-angled corner in a conducting track. The OPC consists of square serifs that are either added to the outside corner or subtracted from the inner corner. Varying degrees of OPC can be applied by changing the size of the square serif or by changing the amount by which it encroaches on or protrudes from the corner. A prototype test mask has been fabricated that contains test structures suitable for on-mask electrical measurement. The same mask was used to print the test pattern in polysilicon and aluminium using an i-line lithography tool and results from these structures clearly show that OPC has an impact on the resistance of the final printed features. In particular, the level of corner rounding is dependent upon the dimensions of the serifs employed and the measured resistance can be used to characterize the effects of different levels of OPC applied to the inner corners.
  • Keywords
    aluminium; electrical resistivity; masks; proximity effect (lithography); silicon; Al; OPC; Si; conducting track; i-line lithography tool; on-mask electrical measurement; optical proximity correction; polysilicon; resistive electrical test structure; square serif; test pattern; Adaptive optics; Current measurement; Electrical resistance measurement; Optical device fabrication; Probes; Resistance; Advanced lithography; critical dimension (CD); optical proximity correction (OPC); test structure;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2011.2181669
  • Filename
    6112691