• DocumentCode
    1411169
  • Title

    VLSI, MCM, and WSI: a design comparison

  • Author

    Swartzlander, Earl E., Jr.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
  • Volume
    15
  • Issue
    3
  • fYear
    1998
  • Firstpage
    28
  • Lastpage
    34
  • Abstract
    Three IC technologies result in different outcomes-performance and cost-in two case studies. The author compares their designs in terms of silicon area, substrate size, and power consumption
  • Keywords
    VLSI; integrated circuit technology; multichip modules; wafer-scale integration; IC technologies; MCM; VLSI; WSI; cost; performance; power consumption; silicon area; substrate size; Bonding; Central Processing Unit; Centralized control; Energy consumption; Integrated circuit testing; Process control; Random access memory; Read-write memory; Silicon; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Design & Test of Computers, IEEE
  • Publisher
    ieee
  • ISSN
    0740-7475
  • Type

    jour

  • DOI
    10.1109/54.706030
  • Filename
    706030