DocumentCode
1411473
Title
Electromechanical Properties of Filamentary
Wires
Author
Kovac, P. ; Kopera, L.
Author_Institution
Inst. of Electr. Eng., Bratislava, Slovakia
Volume
22
Issue
1
fYear
2012
Firstpage
8400106
Lastpage
8400106
Abstract
This work describes the performance of several MgB2 composite wires when subjected to tensile stress at 4.2 K. Electromechanical properties of these wires are influenced by the composite elements encasing the filament and also by the filament´s mechanical strength. A linear increase in critical current by tension up to ≈20% was measured due to compensation of the precompression effect caused by different thermal expansions of composite elements. Final heat treatment influences the electromechanical characteristics of composite wires due to stress recovery and also by interface reactions among the composite elements. Results showed that the highest irreversible strain εirr = 0.9 % was obtained for MgB2 wires reinforced by stainless steel, which has more than doubled εirr in comparison to commercially available MgB2/Nb/Cu/Monel wires with the same filament number.
Keywords
compressibility; compressive strength; critical current density (superconductivity); electromechanical effects; fibre reinforced composites; heat treatment; magnesium compounds; multifilamentary superconductors; stainless steel; surface chemistry; tensile strength; thermal expansion; type II superconductors; composite wires; critical current; electromechanical properties; filamentary MgB2 wires; heat treatment; interface reactions; irreversible strain; mechanical strength; precompression effect; stainless steel reinforcement; stress recovery; superconductors; temperature 4.2 K; tensile stress; tension; thermal expansion; Copper; Critical current; Current measurement; Integrated circuits; Strain; Temperature measurement; Wires; $hbox{MgB}_{2}$ wires; Coefficient of thermal contraction; composite elements; current density; precompression effect; tensile stress;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2011.2175925
Filename
6118318
Link To Document