DocumentCode
141366
Title
Characterization of ionic permeability and water vapor transmission rate of polymers used for implantable electronics
Author
Kirsten, Sabine ; Schubert, Martin ; Uhlemann, Jurgen ; Wolter, Klaus-Jurgen
Author_Institution
Electron. Packaging Lab. Dresden, Tech. Univ. Dresden, Dresden, Germany
fYear
2014
fDate
26-30 Aug. 2014
Firstpage
6561
Lastpage
6564
Abstract
Biocompatible polymers used as encapsulation and packaging materials for implantable electronic devices have to comply with numerous requirements. Especially their barrier properties against water molecules and ions are of particular interest regarding the reliability of the encapsulation as well as functional integrity of the electronic components since water and ions on the circuit board may evoke corrosion, leakage current and finally the failure of the device. This paper describes a measurement setup to investigate the ionic permeability under in vitro conditions of polymeric membranes manufactured from various biocompatible polymers. Ionic permeability and water vapor transmission rate representing the barrier properties of these membranes were investigated. First results were obtained for polyimide, silicone, polyether ether ketone and polyamide, whereas polyimide evinced the best properties.
Keywords
biomedical electronics; biomedical materials; corrosion; encapsulation; membranes; permeability; polymers; prosthetics; silicones; water; barrier properties; biocompatible polymers; circuit board; device failure; electronic components; encapsulation reliability; evoke corrosion; functional integrity; implantable electronic devices; in vitro conditions; ionic permeability characterization; leakage current; measurement setup; packaging materials; polyamide; polyether ether ketone; polyimide; polymeric membranes; silicone; water molecules; water vapor transmission rate; Encapsulation; Permeability; Permeability measurement; Plastics; Pollution measurement; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
Conference_Location
Chicago, IL
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2014.6945131
Filename
6945131
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