• DocumentCode
    1413920
  • Title

    High-density recording capability of granular media composed of Co-Pt grains and SiO2 matrix

  • Author

    Ichihara, K. ; Kikitsu, A. ; Yusu, K. ; Nakamura, F. ; Ogiwara, H.

  • Author_Institution
    Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
  • Volume
    34
  • Issue
    4
  • fYear
    1998
  • fDate
    7/1/1998 12:00:00 AM
  • Firstpage
    1603
  • Lastpage
    1605
  • Abstract
    Co-Pt and SiO2 granular films were prepared on a Cr seed layer. Co-Pt grains dispersed in the SiO2 matrix discretely. Conical grains grew in contact with the Cr layer and spherical grains grew between the conical ones. Coercivity exceeded 2 kOe and coercive squareness reached about 0.7 at a remanent magnetic moment of 0.4 memu/cm2. Activating magnetic moment was 10-15 emu and the index of the thermal stability was about 100. Bit error rate was held below 10-5 up to a linear density of 280 kfci. The recording pattern at the track width of 1 μm was clearly visible. The Co-Pt and SiO2 granular media have potential for 5 Gb/in2 recording
  • Keywords
    cobalt alloys; coercive force; discontinuous metallic thin films; ferromagnetic materials; grain size; magnetic recording noise; magnetic thin films; platinum alloys; remanence; silicon compounds; sputtered coatings; thermal stability; Co-Pt grains; CoPt; CoPt-SiO2 granular films; CoPtSiO2; Cr seed layer; SiO2; SiO2 matrix; TEM images; activating magnetic moment; bit error rate; coercive squareness; coercivity; conical grains; grain size; granular media; high-density recording capability; linear density; media noise; microstructure; recording pattern; remanent magnetic moment; spherical grains; sputtered films; thermal stability index; track width; Bit error rate; Chromium; Coercive force; Couplings; Magnetic films; Magnetic heads; Magnetic properties; Magnetic recording; Magnetic separation; Microstructure;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.706629
  • Filename
    706629