• DocumentCode
    141399
  • Title

    Highly wearable galvanic skin response sensor using flexible and conductive polymer foam

  • Author

    Jeehoon Kim ; Sungjun Kwon ; Sangwon Seo ; Kwangsuk Park

  • Author_Institution
    Interdiscipl. Program of Bioeng., Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2014
  • fDate
    26-30 Aug. 2014
  • Firstpage
    6631
  • Lastpage
    6634
  • Abstract
    Owing to advancements in daily physiological monitoring technology, diverse healthcare applications have emerged recently. The monitoring of skin conductance responses has extensive feasibility to support healthcare applications such as detecting emotion changes. In this study, we proposed a highly wearable and reliable galvanic skin response (GSR) sensor that measures the signals from the back of the user. To enhance its wearability and usability, we employed flexible conductive foam as the sensing material and designed it to be easily attachable to (and detachable from) a wide variety of clothes. We evaluated the sensing reliability of the proposed sensor by comparing its signal with a reference GSR. The average correlation between the two signals was 0.768; this is sufficiently high to validate the feasibility of the proposed sensor for reliable GSR sensing on the back.
  • Keywords
    bioelectric phenomena; biomedical measurement; body sensor networks; electric sensing devices; electrical conductivity; emotion recognition; health care; patient monitoring; polymer foams; skin; average correlation; conductive polymer foam; daily physiological monitoring technology; emotion change detection; flexible conductive foam; flexible polymer foam; healthcare applications; highly wearable galvanic skin response sensor; reference GSR; reliable GSR sensing; sensing material; sensing reliability; skin conductance response monitoring; usability; wearability; Biomedical monitoring; Correlation; Electrodes; Fingers; Reliability; Sensors; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the IEEE
  • Conference_Location
    Chicago, IL
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2014.6945148
  • Filename
    6945148