DocumentCode
1415900
Title
Prediction of paddle shift via 3-D TSOP modeling
Author
Su, Francis ; Hwang, Sheng-Jye ; Lee, Huei-Huang ; Huang, Durn-Yuan
Author_Institution
Dept. of Package Dev., ChipMOS Technol. Inc., Tainan, Taiwan
Volume
23
Issue
4
fYear
2000
fDate
12/1/2000 12:00:00 AM
Firstpage
684
Lastpage
692
Abstract
This study develops a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software
Keywords
computational fluid dynamics; electronic design automation; integrated circuit design; integrated circuit modelling; integrated circuit packaging; moulding; 3D TSOP modeling; Computational Fluid Dynamics; molding process; paddle shift; pressure difference; thin small outline packages; viscous stress; Computational fluid dynamics; Computational modeling; Connectors; Electromagnetic compatibility; Integrated circuit packaging; Manufacturing processes; Predictive models; Software packages; Stress; Wires;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.888854
Filename
888854
Link To Document