Dealing with the heat. Selecting a good thermal interface for reliable chip performance

Author

Ameen, Joseph G. ; Miller, Mark R. ; Yokimcus, Victor P.

Author_Institution

Div. of Mater., W.L. Gore & Associates, Elkton, MD, USA

Volume

14

Issue

4

fYear

1998

fDate

7/1/1998 12:00:00 AM

Firstpage

38

Lastpage

40

Abstract

The need for keeping the package at acceptable temperatures has become a critical issue in recent years. To aid in the cooling of their modules, many electronics manufacturers have implemented the use of heat sinks. Thermal interfaces placed between the package and the heat sink to aid in heat dissipation have become increasingly more important and the demands on these interfaces have increased significantly. During the selection of interface materials many factors must be considered. Compliance, conformability, modulus, ease of installation, and cut-through resistance are all important

Keywords

cooling; heat sinks; integrated circuit packaging; integrated circuit reliability; IC package; IC reliability; compliance; conformability; cooling; cut-through resistance; heat dissipation; heat sinks; installation; interface materials; thermal interface; Circuits; Clocks; Copper; Electronic packaging thermal management; Heat sinks; Permission; Surface resistance; Thermal conductivity; Thermal expansion; Thermal stresses;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.708481

Filename

708481