Enabling flexible datacenter interconnect networks with WDM silicon photonics

Datacenters are creating an unprecedented challenge for optical transceivers requiring multiple high performance lasers, modulators and photodiodes in a single module to meet growing bandwidth needs along with dramatically lower power and cost reflecting the higher volume and density of interconnections. The heterogeneous integration of InP material into a silicon photonics wafer flow enables high performance integrated circuits to be fabricated using established silicon foundry infrastructure. Aurrion has established a library of photonic circuit elements which can be combined to form the single chip solutions for products like 100Gb/s transceivers needed for current and next generation datacenter applications.