3-D FEM/BEM-hybrid modeling of surface mounted devices within planar circuits

Author

Eibert, T.F. ; Hansen, V.

Author_Institution

Radiation Lab., Michigan Univ., Ann Arbor, MI, USA

Volume

46

Issue

9

fYear

1998

fDate

9/1/1998 12:00:00 AM

Firstpage

1334

Lastpage

1336

Abstract

Three-dimensional (3-D) finite-element (FE) meshes of surface-mounted devices (SMDs) are combined with the surface-current models of planar circuits in multilayered media. This is accomplished on the basis of Huygens´ principle via the introduction of equivalent electric and magnetic surface-current densities on a surface enclosing the 3-D parts of the SMDs. The fields in the layered media are described by a surface integral equation based on the dyadic Green´s function of the layered media. Special attention is directed to a proper interface of the surface and 3-D parts of the models. Numerical results for a homogeneous and a multilayered capacitor in a microstrip circuit are presented

Keywords

Green´s function methods; boundary-elements methods; capacitors; electromagnetic field theory; finite element analysis; integral equations; microstrip circuits; modelling; surface mount technology; 3D FEM/BEM-hybrid modeling; 3D finite-element meshes; Huygens principle; SMD; dyadic Green function; electric surface-current densities; homogeneous capacitor; magnetic surface-current densities; microstrip circuit; multilayered capacitor; multilayered media; planar circuits; surface integral equation; surface mounted devices; surface-current models; Capacitors; Circuits; Finite element methods; Integral equations; Iron; Laboratories; Metallization; Microstrip; Nonhomogeneous media; Numerical models;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.709485

Filename

709485