Reel-to-Reel Copper Electroplating on Pulse Laser Deposition Coated Conductor

By applying high-rate copper electroplating technique the reliable fabrication of a copper stabilizer on coated conductor with an 1 μm Ag cap is investigated. The obtained mechanical, electrical and encapsulation properties due to a 20 μm thick Cu stabilizer on the surface improve the practical and technical performance. A copper sulphate CuSO₄ based pulse plating technique is capable to deposit a 20 micrometer thick copper layer in a fast and continuous non-vacuum process. A surround Cu layer protects the HTS conductor surface against salt aqueous solutions, humidity, and against cryogenic liquids LN₂ and liquid helium. With the copper stabilizer conductor solder joining with a contact resistance of 200 nΩcm² becomes possible. Further effort is being made to develop and construct a high-rate and high throughput continuous reel-to-reel modular plating unit for deposition of long length ( >; 400 m). The paper describes the practical achievements within the conductor fabrication.