• DocumentCode
    1422451
  • Title

    Chip-package codesign for high-frequency circuits and systems

  • Author

    Lin, Jenshan

  • Author_Institution
    AT&T Bell Labs., Murray Hill, NJ, USA
  • Volume
    18
  • Issue
    4
  • fYear
    1998
  • Firstpage
    24
  • Lastpage
    32
  • Abstract
    When the need for high frequency combines with the demand for low-cost consumer electronics, the challenge of ensuring correctly functioning components becomes paramount. Focusing on chip-package codesign offers a solution
  • Keywords
    integrated circuit design; packaging; chip-package codesign; consumer electronics; high frequency; low-cost; Chip scale packaging; Circuits and systems; Electronics industry; Electronics packaging; Frequency; Inductance; Integrated circuit packaging; Integrated circuit technology; Pins; Semiconductor device packaging;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/40.710868
  • Filename
    710868
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1422451