• DocumentCode
    1422679
  • Title

    Modeling boron diffusion in thin-oxide p/sup +/ Si gate technology

  • Author

    Fair, Richard B. ; Gafiteanu, Roman A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
  • Volume
    17
  • Issue
    11
  • fYear
    1996
  • Firstpage
    497
  • Lastpage
    499
  • Abstract
    A network defect model suitable for use in process simulation is presented for the diffusion of B in SiO/sub 2/ and, in particular, B in the presence of F and H/sub 2/. We find that B diffuses via a peroxy linkage defect the concentration in the oxide of which changes under different processing conditions. From random walk theory it is possible then to calculate the resulting diffusion coefficients. These results are compared with measured diffusivities and empirical adjustments are made.
  • Keywords
    boron; diffusion; semiconductor process modelling; silicon compounds; Si-SiO/sub 2/:B; boron diffusion; network defect model; peroxy linkage defect; process simulation; random walk; thin-oxide p/sup +/ Si gate technology; Bonding; Boron; Chemicals; Couplings; Intelligent networks; Mechanical engineering; Oxidation; Process design; Scattering; Temperature dependence;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.541760
  • Filename
    541760