DocumentCode
1423326
Title
Interface trap generation by FN injection under dynamic oxide field stress
Author
Chen, T.P. ; Li, Stella ; Fung, S. ; Lo, K.F.
Author_Institution
Dept. of Phys., Hong Kong Univ., Hong Kong
Volume
45
Issue
9
fYear
1998
fDate
9/1/1998 12:00:00 AM
Firstpage
1920
Lastpage
1926
Abstract
Interface trap generation under dynamic (bipolar and unipolar) and dc oxide field stress has been investigated with the charge pumping technique. It is observed that regardless of stress type, whether dc or dynamic (bipolar or unipolar), and the polarity of stress voltage, interface trap generation starts to occur at the voltage at which Fowler-Nordheim (FN) tunneling through the oxide starts to build up. For positive voltage, interface trap generation is attributed to the recombination of trapped holes with electrons and to the bond breaking by the hydrogen (H and H+) released during stressing. For negative voltage, in addition to these two mechanisms, the bond breaking by energetic electrons may also contribute to interface trap generation. The frequency dependence of interface trap generation is also investigated. Interface trap generation is independent of stressing frequency for unipolar stress but it shows a frequency dependence for bipolar stress
Keywords
MOSFET; electron traps; electron-hole recombination; hole traps; interface states; tunnelling; FN injection; Fowler-Nordheim tunneling; MOSFET; bond breaking; charge pumping; dynamic oxide field stress; electron-hole recombination; hydrogen release; interface trap generation; Bonding; Charge carrier processes; Charge pumps; DC generators; Electron traps; Frequency dependence; Spontaneous emission; Stress; Tunneling; Voltage;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.711356
Filename
711356
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