• DocumentCode
    1423326
  • Title

    Interface trap generation by FN injection under dynamic oxide field stress

  • Author

    Chen, T.P. ; Li, Stella ; Fung, S. ; Lo, K.F.

  • Author_Institution
    Dept. of Phys., Hong Kong Univ., Hong Kong
  • Volume
    45
  • Issue
    9
  • fYear
    1998
  • fDate
    9/1/1998 12:00:00 AM
  • Firstpage
    1920
  • Lastpage
    1926
  • Abstract
    Interface trap generation under dynamic (bipolar and unipolar) and dc oxide field stress has been investigated with the charge pumping technique. It is observed that regardless of stress type, whether dc or dynamic (bipolar or unipolar), and the polarity of stress voltage, interface trap generation starts to occur at the voltage at which Fowler-Nordheim (FN) tunneling through the oxide starts to build up. For positive voltage, interface trap generation is attributed to the recombination of trapped holes with electrons and to the bond breaking by the hydrogen (H and H+) released during stressing. For negative voltage, in addition to these two mechanisms, the bond breaking by energetic electrons may also contribute to interface trap generation. The frequency dependence of interface trap generation is also investigated. Interface trap generation is independent of stressing frequency for unipolar stress but it shows a frequency dependence for bipolar stress
  • Keywords
    MOSFET; electron traps; electron-hole recombination; hole traps; interface states; tunnelling; FN injection; Fowler-Nordheim tunneling; MOSFET; bond breaking; charge pumping; dynamic oxide field stress; electron-hole recombination; hydrogen release; interface trap generation; Bonding; Charge carrier processes; Charge pumps; DC generators; Electron traps; Frequency dependence; Spontaneous emission; Stress; Tunneling; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.711356
  • Filename
    711356