Modeling of time-pressure fluid dispensing processes

Author

Chen, X.B. ; Shoenau, G. ; Zhang, W.J.

Author_Institution

Dept. of Mech. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada

Volume

23

Issue

4

fYear

2000

fDate

10/1/2000 12:00:00 AM

Firstpage

300

Lastpage

305

Abstract

The process of time-pressure fluid dispensing has been widely employed in the semiconductor industry, where the fluid is applied to boards or substrates. In such a process, the flow rate of fluid dispensed and the shape of fluid formed on the board are the two most critical performance indexes, yet extremely difficult to represent because of their complex behavior. This paper presents the development of a model for the time-pressure fluid dispensing process, by which the flow rate and shape can be established. Experiments have been performed to validate the model developed

Keywords

Navier-Stokes equations; encapsulation; flow simulation; laminar flow; non-Newtonian flow; non-Newtonian fluids; rheology; semiconductor process modelling; surface mount technology; viscosity; wetting; Navier-Stokes equations; SMT; critical performance indices; encapsulation; equilibrium shape; flow rate; formed fluid shape; laminar flow; non-Newtonian fluid; process model; rheology; semiconductor industry; spreading; time-pressure fluid dispensing; viscosity; wetting; Encapsulation; Fasteners; Fluid dynamics; Fluid flow control; Needles; Performance analysis; Pistons; Rheology; Shape; Surface-mount technology;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.895075

Filename

895075