DocumentCode
1428533
Title
Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies
Author
YAo, Chunhua ; Saluja, Kewal K. ; Ramanathan, Parameswaran
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI, USA
Volume
30
Issue
2
fYear
2011
Firstpage
317
Lastpage
322
Abstract
Conventional power constrained test scheduling methods do not guarantee a thermal-safe solution. In this paper, we propose a test scheduling algorithm that satisfies the resource, power, and thermal constraints. First, in contrast to existing schemes, the proposed algorithm exploits superposition principle to perform fast and accurate thermal simulation, which, in turn, allows the algorithm to search for solutions which introduce cooling periods between tests to reduce the overall test length. Second, we propose a test partition-based method to further improve the performance of the test scheduling. We apply our test scheduling algorithm to ITC´02 SoC benchmarks and the results show considerable improvement in the total test length over existing methods.
Keywords
integrated circuit testing; scheduling; system-on-chip; ITC´02 SoC benchmarks; deep submicron technology; superposition principle; test partition-based method; thermal constrained test scheduling; thermal simulation; Benchmark testing; Computational modeling; Optimization; Power demand; Schedules; Scheduling algorithm; System-on-a-chip; Superposition; system-on-chip (SoC) test; test partition; test scheduling; thermal simulation;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2010.2079350
Filename
5689117
Link To Document