• DocumentCode
    1428533
  • Title

    Power and Thermal Constrained Test Scheduling Under Deep Submicron Technologies

  • Author

    YAo, Chunhua ; Saluja, Kewal K. ; Ramanathan, Parameswaran

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin, Madison, WI, USA
  • Volume
    30
  • Issue
    2
  • fYear
    2011
  • Firstpage
    317
  • Lastpage
    322
  • Abstract
    Conventional power constrained test scheduling methods do not guarantee a thermal-safe solution. In this paper, we propose a test scheduling algorithm that satisfies the resource, power, and thermal constraints. First, in contrast to existing schemes, the proposed algorithm exploits superposition principle to perform fast and accurate thermal simulation, which, in turn, allows the algorithm to search for solutions which introduce cooling periods between tests to reduce the overall test length. Second, we propose a test partition-based method to further improve the performance of the test scheduling. We apply our test scheduling algorithm to ITC´02 SoC benchmarks and the results show considerable improvement in the total test length over existing methods.
  • Keywords
    integrated circuit testing; scheduling; system-on-chip; ITC´02 SoC benchmarks; deep submicron technology; superposition principle; test partition-based method; thermal constrained test scheduling; thermal simulation; Benchmark testing; Computational modeling; Optimization; Power demand; Schedules; Scheduling algorithm; System-on-a-chip; Superposition; system-on-chip (SoC) test; test partition; test scheduling; thermal simulation;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2010.2079350
  • Filename
    5689117