• DocumentCode
    1430299
  • Title

    Package solution of indirectly-heated type thermoelectric power sensors for RF application

  • Author

    Wang, D.B. ; Liao, X.P.

  • Author_Institution
    Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China
  • Volume
    48
  • Issue
    2
  • fYear
    2012
  • Firstpage
    102
  • Lastpage
    103
  • Abstract
    An economical package solution of indirectly-heated type thermoelectric power sensors is proposed for RF application at X-band (8-12GHz). The measured results of output voltages show that they both have an excellent linearity before and after the package. The difference of the sensitivity at 10GHz is 0.02mV/mW. After the package, this power sensor will be conveniently embedded into the RF systems.
  • Keywords
    electric sensing devices; power semiconductor devices; radiofrequency measurement; thermoelectric devices; RF application; X-band; frequency 8 GHz to 12 GHz; indirectly-heated type thermoelectric power sensors;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2011.3178
  • Filename
    6138370
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1430299