• DocumentCode
    1430385
  • Title

    Packaging of PIN Photodiode on Patch Antenna for a Dual-Mode Indoor RF/FSO Receiver

  • Author

    Liao, Jun ; Mirvakili, Ali ; Boryssenko, Anatoliy O. ; Joyner, Valencia M. ; Huang, Zhaoran Rena

  • Author_Institution
    Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • Volume
    1
  • Issue
    3
  • fYear
    2011
  • fDate
    3/1/2011 12:00:00 AM
  • Firstpage
    335
  • Lastpage
    343
  • Abstract
    This paper reports the design, packaging and characterization of a miniaturized dual-mode radio-frequency (RF)/free space optical (FSO) indoor wireless receiver module. Two different patch antennas are designed and integrated with bare die photodiodes together with transimpedance amplifier (TIA) circuits on a printed circuit board (PCB). Ansoft HFSS is used to predict the coupling from RF to FSO link. Measurement results verify that optical link degradation is minimized with the specially designed patch structure. FSO link operation at 2 Gb/s in a 10 GHz RF environment is achieved. Through the comparison to previously developed RF/FSO modules, the new receiver boards demonstrate reduced RF-to-optical cross channel coupling, and increased gain and antenna radiation efficiency.
  • Keywords
    antenna radiation patterns; microstrip antennas; microwave antennas; operational amplifiers; optical links; p-i-n photodiodes; packaging; printed circuits; radio receivers; Ansoft HFSS; FSO link; PIN photodiode packaging; RF coupling; RF-to-optical cross channel coupling; antenna radiation; bit rate 2 Gbit/s; dual-mode radio-frequency-free space optical indoor wireless receiver module; frequency 10 GHz; optical link degradation; patch antenna; printed circuit board; transimpedance amplifier circuit; Antenna measurements; Antenna radiation patterns; Bonding; Patch antennas; Radio frequency; Substrates; Dual mode wireless communication; free space optics; hybrid packaging; patch antenna;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2010.2101730
  • Filename
    5692868