Design of mixed-signal systems-on-a-chip

Author

Kundert, Ken ; Chang, Henry ; Jefferies, Dan ; Lamant, Gilles ; Malavasi, Enrico ; Sendig, Fred

Author_Institution

Cadence Design Syst. Inc., San Jose, CA, USA

Volume

19

Issue

12

fYear

2000

fDate

12/1/2000 12:00:00 AM

Firstpage

1561

Lastpage

1571

Abstract

The electronics industry is increasingly focused on the consumer marketplace, which requires low-cost high-volume products to be developed very rapidly. This, combined with advances in deep submicrometer technology have resulted in the ability and the need to put entire systems on a single chip. As more of the system is included on a single chip, it is increasingly likely that the chip will contain both analog and digital sections. Developing these mixed-signal (MS) systems-on-chip presents enormous challenges both to the designers of the chips and to the developers of the computer-aided design (CAD) systems that are used during the design process. This paper presents many of the issues that act to complicate the development of large single-chip MS systems and how CAD systems are expected to develop to overcome these issues

Keywords

VLSI; circuit CAD; circuit layout CAD; integrated circuit design; mixed analogue-digital integrated circuits; ASIC design; CAD systems; analog sections; computer-aided design; deep submicron technology; digital sections; mixed-signal SoC design; mixed-signal systems-on-a-chip; Application specific integrated circuits; Circuit testing; Design automation; Design methodology; Electronic design automation and methodology; Integrated circuit layout; Integrated circuit modeling; Integrated circuit technology; Space technology; Time to market;

fLanguage

English

Journal_Title

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on

Publisher

ieee

ISSN

0278-0070

Type

jour

DOI

10.1109/43.898832

Filename

898832