• DocumentCode
    1438336
  • Title

    Theory and observation of enhanced, high field hole transport in Si 1-xGex quantum well p-MOSFETs

  • Author

    Bhaumik, Kaushik ; Shacham-Diamand, Yosi ; Noel, J.P. ; Bevk, Joze ; Feldman, L.C.

  • Author_Institution
    McKinsey & Co., Houston, TX, USA
  • Volume
    43
  • Issue
    11
  • fYear
    1996
  • fDate
    11/1/1996 12:00:00 AM
  • Firstpage
    1965
  • Lastpage
    1971
  • Abstract
    We report on the observation of enhanced high field hole velocity in strained Si/Si1-xGex/Si quantum wells. This effect manifests itself in the drive current capability of nanometer scale p-channel Quantum Well Metal-Oxide-Semiconductor-Field-Effect-Transistors (p-QWMOSFETs). The high-field transport of a two-dimensional hole gas confined in a Si/Si 1-xGex/Si quantum well is formulated and solved. The results indicate an increase in the hole saturated drift velocity in strained SiGe quantum wells with increasing Ge mole fractions up to x=0.5. This is a consequence of the optical phonon spectrum of the strained SiGe alloy remaining Si-like (i.e., high energy) while the carrier transverse effective mass decreases with higher Ge content. To investigate the theoretical prediction of increased high-field drift velocity, p-QWMOSFETs were fabricated with Si/Sii-xGex /Si quantum well heterostructures grown by Molecular Beam Epitaxy (MBE) with varying Ge mole fractions, x. The fabrication sequence maintained a low thermal budget to prevent strain relaxation in the SiGe layer and involved a mixed optical/electron beam lithography scheme to define junction-isolated transistors with a minimum drawn gate lengths of 200 nm. The measured saturated transconductance, gmsat, of the p-QWMOSFETs were 20-50% higher than that of a reference Si pMOSFET under equivalent biasing conditions. The importance of this gmsat increase for high-speed, low-power VLSI applications is discussed
  • Keywords
    Ge-Si alloys; MOSFET; electron beam lithography; electron-phonon interactions; high field effects; hole mobility; nanotechnology; photolithography; semiconductor materials; semiconductor quantum wells; two-dimensional electron gas; 200 nm; Ge mole fraction; MBE; Si-SiGe-Si; Si/Si1-xGex/Si quantum well; Si1-xGex quantum well p-MOSFET; carrier transverse effective mass; drive current capability; enhanced high field hole transport; high-speed low-power VLSI applications; hole saturated drift velocity; junction-isolated transistors; low thermal budget fabrication; minimum drawn gate length; mixed optical/electron beam lithography; nanometer scale p-QWMOSFET; optical phonon spectrum; saturated transconductance; strain relaxation prevention; strained SiGe quantum wells; two-dimensional hole gas; Electron mobility; Germanium alloys; Germanium silicon alloys; High speed optical techniques; Molecular beam epitaxial growth; Optical saturation; Phonons; Quantum mechanics; Silicon germanium; Two dimensional hole gas;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.543034
  • Filename
    543034