• DocumentCode
    1446002
  • Title

    Accurate and Analytical Statistical Spatial Correlation Modeling Based on Singular Value Decomposition for VLSI DFM Applications

  • Author

    Liu, Jui-Hsiang ; Tsai, Ming-Feng ; Chen, Lumdo ; Chen, Charlie Chung-Ping

  • Author_Institution
    Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    29
  • Issue
    4
  • fYear
    2010
  • fDate
    4/1/2010 12:00:00 AM
  • Firstpage
    580
  • Lastpage
    589
  • Abstract
    With the significant advancement of statistical timing and yield analysis algorithms, there is a strong need for accurate and analytical spatial correlation models. In this paper, we propose a novel spatial correlation modeling method that can not only capture the general spatial correlation relationship but also can generate highly accurate and analytical models. Our method, based on singular value decomposition, can generate sequences of polynomial weighted by the singular values. Experimental results from foundry measurement data show that our proposed approach is 3x accuracy improvement over several distance based spatial correlation modeling methods.
  • Keywords
    VLSI; singular value decomposition; statistical analysis; VLSI DFM applications; foundry measurement; singular value decomposition; statistical spatial correlation modeling; statistical timing; very large scale integration; yield analysis algorithm; Algorithm design and analysis; Analytical models; Design for manufacture; Foundries; Integrated circuit technology; Semiconductor process modeling; Singular value decomposition; Threshold voltage; Timing; Very large scale integration; Process variation; SVD; spatial correlation;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2010.2042890
  • Filename
    5433751