DocumentCode
1446080
Title
Estimating the Yield Strength of Thin Metal Films Through Elastic–Plastic Buckling-Induced Debonding
Author
Goyal, S. ; Srinivasan, K. ; Subbarayan, G. ; Siegmund, T.
Author_Institution
Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
Volume
11
Issue
2
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
358
Lastpage
361
Abstract
In this correspondence, we propose a procedure to estimate the yield strength of thin films by debonding films from their substrate by elastic-plastic buckling under thermally induced compressive loading. The out-of-plane displacement of the metal lines under conditions of elastic-plastic buckling is dependent on the yield strength of the film. Thus, an inverse estimate of the yield strength is made from measurements of the out-of-plane displacements of the buckled metal lines. The procedure is demonstrated to estimate the yield strength of aluminum lines consistent with the measurements by other techniques.
Keywords
aluminium; buckling; elastoplasticity; metallic thin films; yield strength; Al; aluminum thin films; elastic-plastic buckling-induced debonding; metal lines; out-of-plane displacement; thermally induced compressive loading; thin metal films; yield strength; Aluminum; Plastics; Resists; Substrates; Temperature measurement; Buckling; debond; metal films; yield strength;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2011.2112362
Filename
5710576
Link To Document