• DocumentCode
    1447862
  • Title

    High- V_{\\rm GS} PFET DC Hot-Carrier Mechanism and Its Relation to AC Degradation

  • Author

    Rauch, Stewart E. ; Guarin, Fernando ; La Rosa, Giuseppe

  • Author_Institution
    Semicond. R&D Center, IBM Microelectron., Hopewell Junction, VA, USA
  • Volume
    10
  • Issue
    1
  • fYear
    2010
  • fDate
    3/1/2010 12:00:00 AM
  • Firstpage
    40
  • Lastpage
    46
  • Abstract
    Recently, negative bias temperature instability (NBTI) enhanced by local self-heating has been proposed as a mechanism for high-Vg PFET ??hot-carrier?? degradation. This is based on the idea that the effective temperature for NBTI is increased in the drain region due to a very localized self-heating effect reported in the literature by Pop and others. Our PFET dc stress data are consistent with local self-heating activated NBTI at high Vg , but at mid Vg, we observed similar behavior to typical NFET hot carriers, i.e., energy-driven hot carrier (EDHC). If self-heating is involved with the PFET high-Vg dc degradation, the question of ac behavior naturally arises. Our PFET ring-oscillator stress results demonstrate that the high-VGS PFET hot carrier dominant under dc stress does not significantly contribute under typical CMOS switching conditions, whereas the mid-VGS hot carrier does. This supports the idea that the predominant damage mechanism involved at high VGS is NBTI enhanced by local self-heating with a thermal time constant longer than a few hundred picoseconds.
  • Keywords
    CMOS digital integrated circuits; field effect transistors; hot carriers; oscillators; semiconductor device reliability; AC degradation; CMOS switching; EDHC; NBTI; NFET hot carriers; PFET ring-oscillator; energy-driven hot carrier; high-VGS PFET DC hot-carrier degradation; localized self-heating; negative bias temperature instability; thermal time constant; CMOS digital integrated circuits; PFET; hot carriers; reliability modeling;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2009.2032298
  • Filename
    5256237