• DocumentCode
    1448606
  • Title

    Effect of Grain Size on Pressure-Induced Tin Whisker Formation

  • Author

    Shibutani, Tadahiro

  • Author_Institution
    Fac. of Environ. & Inf. Sci., Yokohama Nat. Univ., Hodogaya, Japan
  • Volume
    33
  • Issue
    3
  • fYear
    2010
  • fDate
    7/1/2010 12:00:00 AM
  • Firstpage
    177
  • Lastpage
    182
  • Abstract
    This paper discusses the effect of grain size on pressure-induced tin whisker formation. Since a pressure has to overcome the increase in surface energy involved with tin whisker growth, a threshold stress for tin whisker growth exists. Based on traditional nucleation theory, the threshold stress is inversely proportional to the radius of the whisker. For the verification of the proposed theory, nanoindentation tests were carried out on three kinds of finishes with different grain sizes; tin-copper, bright tin, and matte tin. Whiskers and nodules were formed at the contact edge as the applied load increases up to the critical value related to grain size. The finite-element analysis revealed that high pressure concentrates near the contact edge on the tin-copper finish. The value of pressure to whisker formation is up to 40 MPa. This value agrees with the estimation from the proposed theory with a whisker radius of 0.1 μ m. Based on the proposed theory, the difference between whiskers and hillocks can be explained.
  • Keywords
    finite element analysis; grain size; nanoindentation; nucleation; tin; whiskers (crystal); Sn; finite-element analysis; grain size; nanoindentation; nucleation theory; pressure-induced tin whisker formation; threshold stress; Compressive stress; Finite element methods; Grain size; Residual stresses; Stress measurement; Surface finishing; Surface morphology; Testing; Thermal stresses; Tin; Grain size; hillock; indentation; pressure; tin whisker;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2010.2042060
  • Filename
    5437214