• DocumentCode
    1455801
  • Title

    High-reliability, low-energy microarchitecture synthesis

  • Author

    Dasgupta, Aurobindo ; Karri, Ramesh

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
  • Volume
    17
  • Issue
    12
  • fYear
    1998
  • fDate
    12/1/1998 12:00:00 AM
  • Firstpage
    1273
  • Lastpage
    1280
  • Abstract
    Continuous scaling of device dimensions has accelerated the power dissipation and electromigration-induced reliability degradation in integrated circuits. Submicrometer scaling increases the fraction of on-chip energy dissipated on long interconnects and buses. In addition, submicrometer-level scaling increases current density in long interconnects and buses, causing structural damage in metal lines due to electromigration (a major failure phenomenon in integrated circuits). We present algorithms for synthesizing high-reliability, low-energy microarchitectures. This can be realized by judiciously binding and scheduling the data transfers of a control-data-flow graph representation of an application onto the buses in the microarchitecture. The algorithm considers (i) correlations between data transfers, (ii) constraints on the number of buses, and (iii) area and delay
  • Keywords
    data flow graphs; electromigration; failure analysis; high level synthesis; integrated circuit design; integrated circuit interconnections; integrated circuit reliability; low-power electronics; system buses; RT level; algorithm; bus; control data flow graph; electromigration; energy optimization; failure; integrated circuit; interconnect; metal line; microarchitecture synthesis; power dissipation; reliability; submicrometer scaling; Acceleration; Current density; Degradation; Delay; Electromigration; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit synthesis; Microarchitecture; Power dissipation;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.736567
  • Filename
    736567