• DocumentCode
    14574
  • Title

    Gate Bias Stress-Induced Threshold Voltage Shift Effect of a-IGZO TFTs with Cu Gate

  • Author

    Xiang Liu ; Wang, L.L. ; Ce Ning ; Hehe Hu ; Wei Yang ; Ke Wang ; Seong Yeol Yoo ; Shengdong Zhang

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • Volume
    61
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    4299
  • Lastpage
    4303
  • Abstract
    The gate bias stress-induced threshold voltage shift effect of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs) with Cu gate is investigated in this brief. It is revealed that the Cu-gated TFTs with SiOx gate insulator suffer from serious electrical performance degradation under gate bias stress owing to Cu diffusion into the gate insulator and channel region. A stacked gate insulator of SiOx/SiNx is then proposed to suppress the Cu diffusion. Experimental results show that the Cu-gated TFTs with the stacked gate insulators have a comparable threshold voltage shift effect with that of the conventional TFTs with Mo electrode and SiOx insulator, under both positive and negative gate bias stresses.
  • Keywords
    amorphous semiconductors; copper; diffusion; gallium compounds; indium compounds; insulating materials; silicon compounds; thin film transistors; zinc compounds; Cu; Cu diffusion; Cu-gated TFT; InGaZnO; SiOx-SiNx; SiOx gate insulator; a-IGZO TFT; amorphous indium gallium zinc oxide thin-film transistors; channel region; electrical performance degradation; gate bias stress-induced threshold voltage shift effect; stacked gate insulator; Insulators; Logic gates; Stress; Thin film transistors; Threshold voltage; Voltage measurement; Amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs); copper diffusion; copper gate; stacked gate insulator; threshold voltage shift; threshold voltage shift.;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2362850
  • Filename
    6937174