• DocumentCode
    1458454
  • Title

    Electromagnetic and thermal performance validation of finned rails for EM launch

  • Author

    Noel, Andrew P. ; Bauer, David P. ; Hisle, Rodney E.

  • Author_Institution
    IAP Res. Inc., Dayton, OH, USA
  • Volume
    37
  • Issue
    1
  • fYear
    2001
  • fDate
    1/1/2001 12:00:00 AM
  • Firstpage
    450
  • Lastpage
    453
  • Abstract
    The design of fieldable electromagnetic launchers must carefully balance structural, thermal and electromagnetic performance in conjunction with suitable life. IAP Research has been developing a novel launcher concept in which the barrel is constructed from mostly metal materials. Analysts has indicated that the design has relatively high inductance gradient, combined with high passive thermal performance. This enhanced performance derives from the use of transverse copper laminations on the nonbore surfaces of each rail. These laminations induce more current flow on the bore surfaces and thus reduce the apparent thickness of the rails, increasing the bore magnetic field. At the same time, the rail fins absorb and quickly distribute the heat generated in the rail to outer portions of the gun for ambient air cooling. Subsequent experiments have validated the concept. This paper describes the study conducted by IAP Research and IAT to validate the performance of finned rail technology
  • Keywords
    electromagnetic fields; electromagnetic launchers; inductance; laminations; thermal analysis; ambient air cooling; current flow; electromagnetic performance validation; finned rail EM launcher; finned rail technology; inductance gradient; metallic barrel; nonbore surfaces; passive thermal performance; thermal performance validation; transverse copper laminations; Boring; Copper; Electromagnetic fields; Electromagnetic launching; Inductance; Inorganic materials; Lamination; Magnetic fields; Performance analysis; Rails;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.911874
  • Filename
    911874