• DocumentCode
    1458775
  • Title

    Monitoring interface traps by DCIV method

  • Author

    Cai, Jin ; Sah, Chih-Tang

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    20
  • Issue
    1
  • fYear
    1999
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    DCIV method is demonstrated as a production monitoring tool for process-residue interface traps. The high sensitivity of the methodology attained from forward-biasing a p-n junction allows routine detection of as few as 100 active interface traps in small area MOS transistors. Examples are given for MOST´s from five different sub-half-micron production technologies. The body recombination current shows peaks around the intrinsic surface condition whose amplitude is proportional to the number of active interface traps in the mid-channel region. The variation of the peak amplitude with the forward bias voltage follows exactly the single-energy level formula, from which the interface-trap energy level can be determined to a few tenths of a kT accuracy.
  • Keywords
    MOS integrated circuits; MOSFET; electric current measurement; integrated circuit manufacture; integrated circuit measurement; interface states; process monitoring; semiconductor device manufacture; semiconductor device measurement; semiconductor-insulator boundaries; DCIV method; MOST; active interface traps; body recombination current; forward bias voltage; interface traps monitoring; interface-trap energy level; intrinsic surface condition; mid-channel region; p-n junction; process-residue interface traps; production monitoring tool; single-energy level formula; small area MOS transistors; sub-half-micron production technologies; Charge carrier processes; Current measurement; Electron traps; Energy states; MOSFETs; Monitoring; Production; Radiative recombination; Steady-state; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.737574
  • Filename
    737574