Embedded transmission-Line (ETL) MMIC for low-cost high-density wireless communication applications

Author

Tserng, Hua-Quen ; Saunier, Paul ; Ketterson, Andrew ; Witkowski, Larry C. ; Jones, Ted

Author_Institution

MMIC R&D Lab., Dallas, TX, USA

Volume

45

Issue

12

fYear

1997

fDate

12/1/1997 12:00:00 AM

Firstpage

2540

Lastpage

2548

Abstract

A new embedded transmission-line (ETL) monolithic-microwave integrated-circuit (MMIC) approach which allows flexibility in mixing different transmission-line types (i.e., coplanar and striplines) for maximum MMIC design flexibility and permits the feasibility of eliminating backside processing for low production cost is described. This ETL MMIC approach is an enabling technology allowing for low-cost batch fabrication, and high-density integration of microwave and RF components (including silicon mixed-signal products) for emerging wireless communication applications. Designs and performance results of a number of ETL MMICs are described in this paper

Keywords

MMIC amplifiers; MMIC phase shifters; integrated circuit design; mixed analogue-digital integrated circuits; mobile communication; strip line circuits; MMIC design flexibility; embedded transmission-line MMIC; high-density wireless communication applications; low-cost batch fabrication; mixed-signal products; production cost; Costs; Fabrication; MMICs; Microwave technology; Production; Radio frequency; Silicon; Stripline; Transmission lines; Wireless communication;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.643871

Filename

643871