DocumentCode
1460526
Title
Contamination issues in gas delivery for semiconductor processing
Author
Krishnan, Sowmya ; Laparra, Olivier
Author_Institution
Ultra Clean Technol., Menlo Park, CA, USA
Volume
10
Issue
2
fYear
1997
fDate
5/1/1997 12:00:00 AM
Firstpage
273
Lastpage
278
Abstract
The contamination contribution from two functionally similar gas delivery systems supplying a process tool is quantified in this investigation. The conventional gas delivery system consists of single-melt stainless steel tubing (~20 Ra), elastomer components, and the ultraclean gas delivery system consists of double-melt stainless steel (~5 Ra), all metal components. Moisture, oxygen, and hydrocarbon impurities desorbing from the wetted surfaces of the gas delivery system are analyzed using an atmospheric pressure ionization mass spectrometer (APIMS). Particle contamination from components in the gas delivery system is characterized with a condensation nucleus counter (CNC) using static and dynamic testing. Corrosion-induced particulate occurring in the heat-affected-zone (HAZ) near welded portions in tubing is also studied. The moisture contribution of the conventional gas delivery system is a factor of six greater than that from the ultraclean gas delivery system and the oxygen contamination is a factor of three greater. The particle shedding (0.01 μm) in the static mode from the conventional manifold is 20 times greater than that from the ultraclean manifold. The HAZ of the conventional weldment shows aggressive corrosion-induced particulate and loss of the electropolished surface compared to the HAZ of the ultraclean weldment. The effect of the choice of material, components and manufacturing techniques is correlated to the extent of contamination contributed by the gas delivery system
Keywords
semiconductor technology; surface contamination; all metal component; atmospheric pressure ionization mass spectrometry; condensation nucleus counting; corrosion; double-melt stainless steel tubing; elastomer component; electropolished surface; gas delivery system; heat-affected-zone; hydrocarbon impurity; moisture; oxygen impurity; particle contamination; semiconductor processing; single-melt stainless steel tubing; ultraclean gas delivery system; weldment; Computer numerical control; Counting circuits; Hydrocarbons; Impurities; Ionization; Mass spectroscopy; Moisture; Steel; Surface contamination; Welding;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.572082
Filename
572082
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