Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips

Author

Harendt, Christine ; Zili Yu ; Burghartz, Joachim N. ; Kostelnik, Jan ; Kugler, Andreas ; Saller, Stefan

Author_Institution

Inst. fur Mikroelektron. Stuttgart (IMS CHIPS), Stuttgart, Germany

fYear

2014

fDate

22-26 Sept. 2014

Firstpage

210

Lastpage

213

Abstract

Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component.

Keywords

flexible electronics; integrated circuit reliability; microprocessor chips; printed circuits; HySiF; embedded chips; embedded electronics; flexible electronics; hybrid systems in foil; large-area thin-film electronic elements; printed electronics; thin-chip assembly; thin-chip fabrication; thin-chip reliability; ultrathin flexible chips; Assembly; Flexible electronics; Integrated circuits; Reliability; Sensors; Silicon; Stress; bending stress measurement; chip warpage; embedded component technology; embedding; flexible electronics; hybrid system-in-foil; mechanical stability; ultra-thin chips;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Device Research Conference (ESSDERC), 2014 44th European

Conference_Location

Venice

ISSN

1930-8876

Print_ISBN

978-1-4799-4378-4

Type

conf

DOI

10.1109/ESSDERC.2014.6948797

Filename

6948797