Recent advances in potted and printed circuits

The various potting resins are described in relation to the variation of properties with different proportions of hardener and the effects on the parameters of the potted components. The causes of failure of potted circuits are discussed. Design problems in the use of printed circuits are examined with particular reference to questions of conductor thickness and spacing. A method of sealing printed circuits by a thin polysulphide rubber layer which is sprayed or brushed on is described.