Fabrication of Silicon-on-Diamond Substrate and Low-Loss Optical Waveguides

Author

Liang, Di ; Fiorentino, Marco ; Todd, Shane T. ; Kurczveil, Geza ; Beausoleil, Raymond G. ; Bowers, John E.

Author_Institution

HP Labs., Palo Alto, CA, USA

Volume

23

Issue

10

fYear

2011

fDate

5/15/2011 12:00:00 AM

Firstpage

657

Lastpage

659

Abstract

A simple, complementary metal-oxide-semiconductor (CMOS)-compatible fabrication technique is developed to demonstrate a robust silicon-on-diamond (SOD) substrate. The 2.5 μm × 700 nm waveguides with a spiral structure are fabricated on both SOD and conventional silicon-on-insulator (SOI) substrates, showing 0.74- and 0.54-dB/cm propagation loss, respectively. Finite element method (FEM) thermal simulation shows over 3× improvement in heat dissipation on a hybrid silicon laser structure when Si substrate is not a limiting factor.

Keywords

CMOS integrated circuits; cooling; diamond; finite element analysis; optical fabrication; optical losses; optical waveguides; silicon-on-insulator; CMOS; FEM; SOD; Si-C; complementary metal-oxide-semiconductor; finite element method; heat dissipation; low-loss optical waveguides; propagation loss; silicon-on-diamond substrate; silicon-on-insulator; size 2.5 mum; size 700 nm; thermal simulation; Interference; Optical fiber networks; Optical fiber sensors; Optical fibers; Sensitivity; Wavelength measurement; Diamond; hybrid integrated circuit thermal factors; silicon-on-insulator (SOI) technology; wafer bonding; waveguides;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2011.2123089

Filename

5724276