Mobile handset power amplifiers

Handset RF power amplifier (PA) module design is a complex process that involves a great number of tradeoffs. High efficiency, small size, and low cost are the main design goals. The incessant size reduction of handsets and their increased functionality will continue to put pressure on PA designers to achieve a high level of performance in even smaller packages by developing novel integration and packaging technologies. The handset PA module industry is severely challenged by cost and size. It is hard to justify any improvement in performance if it comes at a higher price tag or larger dimensions. These facts have prevented many technological advances, e.g., Chireix, Doherty and Kahn techniques, MEMS, reconfigurable matching networks, gallium nitride, etc., from being widely utilized today in handset PA modules. However, a breakthrough in any of these technologies could enable its widespread adoption.