A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Author

Kim, Myunghoi ; Koo, Kyoungchoul ; Hwang, Chulsoon ; Shim, Yujeong ; Kim, Joungho ; Kim, Jonghoon

Author_Institution

Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea

Volume

54

Issue

3

fYear

2012

fDate

6/1/2012 12:00:00 AM

Firstpage

689

Lastpage

695

Abstract

In this paper, we propose a compact and wideband electromagnetic bandgap (EBG) structure using a defected ground structure (DGS) to significantly enhance the wideband suppression of power/ground noise coupling in multilayer packages and printed circuit boards. The proposed EBG structure is implemented simply by adding a rectangular-shaped DGS which is etched periodically onto the ground plane without changing any other geometrical parameter from a mushroom-type EBG structure. The DGS effects on the f_L and f_U are thoroughly analyzed using the dispersion characteristics. We experimentally verified that the proposed EBG structure achieved the wideband power/ground noise suppression (below -40 dB) between 2.5 and 16.2 GHz. In addition, we demonstrated the considerable reduction in f_L from 3.4 to 2.5 GHz and a significant increase in f_U from 9.1 to 16.2 GHz when compared with the mushroom-type EBG structure.

Keywords

defected ground structures; electronics packaging; interference suppression; photonic band gap; printed circuits; DGS effects; PCB; compact electromagnetic bandgap structure; defected ground structure; dispersion characteristics; frequency 3.4 GHz to 2.5 GHz; frequency 9.1 GHz to 16.2 GHz; geometrical parameter; ground plane; multilayer package; mushroom-type EBG structure; power-ground noise wideband suppression; printed circuit boards; rectangular-shaped DGS; wideband electromagnetic bandgap structure; Dispersion; Mathematical model; Metamaterials; Noise; Periodic structures; TV; Wideband; Defected ground structure; electromagnetic bandgap; package; power/ground noise; printed circuit board;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/TEMC.2012.2187662

Filename

6169981