Comparative study of thermally conductive fillers for use in liquid encapsulants for electronic packaging

Author

Wong, C.P. ; Bollampally, Raja S.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

22

Issue

1

fYear

1999

fDate

2/1/1999 12:00:00 AM

Firstpage

54

Lastpage

59

Abstract

Thermal management plays a very vital role in the packaging of high performance electronic devices. Effective heat dissipation is crucial to enhance the performance and reliability of the packaged devices. Liquid encapsulants used for glob top, potting, and underfilling applications can strongly influence the package heat dissipation. Unlike molding compounds, the filler loading in these encapsulants is restrained. This paper deals with the development and characterization of thermally conductive encapsulants with relatively low filler loading. A comparative study on the effect of different ceramic fillers on the thermal conductivity and other critical properties of an epoxy based liquid encapsulant is presented

Keywords

cooling; encapsulation; reliability; thermal conductivity; thermal management (packaging); electronic packaging; filler loading; glob top; heat dissipation; liquid encapsulants; potting; reliability; thermal conductivity; thermal management; thermally conductive fillers; underfilling applications; Ceramics; Conducting materials; Electronic packaging thermal management; Flip chip; Semiconductor device packaging; Silicon compounds; Thermal conductivity; Thermal loading; Thermal management; Thermal resistance;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.746543

Filename

746543