DocumentCode
1473560
Title
Characterization and performance prediction for integral resistors in low temperature co-fired ceramic technology
Author
Delaney, Kieran ; Barrett, John ; Barton, John ; Doyle, Rory
Author_Institution
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Volume
22
Issue
1
fYear
1999
fDate
2/1/1999 12:00:00 AM
Firstpage
78
Lastpage
85
Abstract
This paper addresses the electrical characterization of integral resistors in low temperature co-fired ceramic (LTCC). The resistors form part of an integral component technology that also includes capacitors and inductors. The geometry and fabrication of the integral resistors is summarized, describing a screen-printing method that places the resistors 200 μm into the substrate. A test vehicle made to analyze the technique, 150 samples of which were characterized, is described. Three different resistor pastes are analyzed; 104 Ω/sq, .66 kΩ/sq, and 6.2 kΩ/sq. In addition, further parameters are investigated, including the effects of lamination pressure, resistor size, and the use of trim-holes in the technology. The results of the analyzes are summarized with regard to the impact of applied frequency, temperature, and DC voltage. The paper then discusses the development of performance predictive functions for the variations in the resistors, functions which are necessary to enable designers to develop circuits for applications in a wide range of operating environments. The results of a geometric analysis of the resistors are presented, and are used to permit accurate, simple electrical models to be made using analytical methods. The models are needed by process engineers to optimize resistor performance, and by design engineers as means of defining the correct component geometries for their circuits
Keywords
ceramics; thick film resistors; LTCC substrate; electrical model; fabrication; geometric analysis; integral resistor; lamination pressure; low temperature co-fired ceramic technology; performance predictive function; screen printing; test vehicle; trim hole; Capacitors; Ceramics; Circuits; Design engineering; Fabrication; Geometry; Inductors; Resistors; Solid modeling; Temperature;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.746546
Filename
746546
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