A multi-layer thick film interconnection system

The paper describes a multi-layer interconnection system suitable for 50¿100 unencapsulated integrated circuit elements of the type used in high-speed computers. The power and earth planes with their associate dielectrics are made using the thick film technique. Methods of producing the conductor and dielectric films are discussed. Two additional conductor planes, forming the signal matrix in which the logic connections are made, are deposited by the thin film technique.