• DocumentCode
    1477462
  • Title

    A substrate integrated folded waveguide (SIFW) H-plane band-pass filter with double H-plane septa based on LTCC

  • Author

    Wang, Zhengwei ; Bu, Shirong ; Luo, Zhengxiang

  • Author_Institution
    Sch. of Optoelectron. Inf., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • Volume
    59
  • Issue
    3
  • fYear
    2012
  • fDate
    3/1/2012 12:00:00 AM
  • Firstpage
    560
  • Lastpage
    563
  • Abstract
    In this paper, a novel substrate integrated folded waveguide (SIFW) H-plane band-pass filter based on low-temperature co-fired ceramic technology (LTCC) is proposed which employs double H-plane septa of a short-ended evanescent waveguide as an impedance inverter. The filter has advantages of convenient integration, compact, low cost, mass-producibility, and ease of fabrication, and it also has frequency responses similar to those of traditional E-plane double-iris waveguide band-pass filters. To validate the new proposed topology, a three-pole narrowband band-pass filter is designed and fabricated using half-wavelength resonators. A comparison between measured results and simulated results shows good agreement.
  • Keywords
    band-pass filters; ceramic packaging; substrate integrated waveguides; waveguide filters; E-plane; H-plane band-pass filter; LTCC; SIFW; double H-plane septa; double-iris waveguide band-pass filter; frequency response; half-wavelength resonator; impedance inverter; low-temperature cofired ceramic technology; short-ended evanescent waveguide; substrate integrated folded waveguide; three-pole narrowband band-pass filter; Band pass filters; Filtering theory; Microwave filters; Rectangular waveguides; Resonator filters; Substrates; Waveguide components; Acoustics; Electronics; Equipment Design; Equipment Failure Analysis; Micro-Electrical-Mechanical Systems; Systems Integration; Telecommunications;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2012.2229
  • Filename
    6174205