• DocumentCode
    1478793
  • Title

    A Circuit-Level Substrate Current Model for Smart-Power ICs

  • Author

    Conte, Fabrizio Lo ; Sallese, Jean-Michel ; Pastre, Marc ; Krummenacher, François ; Kayal, Maher

  • Author_Institution
    Electron. Lab., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
  • Volume
    25
  • Issue
    9
  • fYear
    2010
  • Firstpage
    2433
  • Lastpage
    2439
  • Abstract
    This paper presents a new modeling methodology accounting for generation and propagation of minority carriers that can be used directly in circuit-level simulators in order to estimate coupled parasitic currents. The method is based on a new compact model of basic components (p-n junction and resistance) and takes into account minority carriers at the boundary. An equivalent circuit schematic of the substrate is built by identifying these basic elements in the substrate and interconnecting them. Parasitic effects such as bipolar or latch-up effects result from the continuity of minority carriers guaranteed by the components´ models. A structure similar to a half-bridge perturbing sensitive n-wells has been simulated. It is composed by four p-n junctions connected together by their common p-doped sides. The results are in good agreement with those obtained from physical device simulations.
  • Keywords
    equivalent circuits; integrated circuit modelling; minority carriers; p-n junctions; power bipolar transistors; power integrated circuits; semiconductor device models; substrates; bipolar effects; bipolar transistor; circuit-level simulators; circuit-level substrate current model; coupled parasitic currents; equivalent circuit; half-bridge perturbing sensitive n-wells; high-voltage transistor; latch-up effects; minority carrier generation; minority carrier propagation; p-n junction compact model; resistance model; smart-power IC; Bipolar transistors; Circuit simulation; Coupling circuits; Electromagnetic interference; Integrated circuit modeling; Integrated circuit noise; Laboratories; Polarization; Power integrated circuits; Substrates; IC; lumped modeling; methodology modeling; noise; parasitic coupling; power parasitic modeling; power semiconductor devices; smart power IC; substrate modeling;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2010.2048761
  • Filename
    5454267