Development and Application of a Novel Microfabricated Device for the In Situ Tensile Testing of 1-D Nanomaterials

Author

Ganesan, Yogeeswaran ; Lu, Yang ; Peng, Cheng ; Lu, Hao ; Ballarini, Roberto ; Lou, Jun

Author_Institution

Dept. of Mech. Eng. & Mater. Sci., Rice Univ., Houston, TX, USA

Volume

19

Issue

3

fYear

2010

fDate

6/1/2010 12:00:00 AM

Firstpage

675

Lastpage

682

Abstract

We report on the development and application of a silicon microdevice for the in situ quantitative mechanical characterization of single 1-D nanomaterials within a scanning electron microscope equipped with a quantitative nanoindenter. The design makes it possible to convert a compressive nanoindentation force applied to a shuttle to uniaxial tension on a specimen attached to a sample stage. Finite-element analysis and experimental calibration have been employed to extract the specimen stress versus strain curve from the indentation load versus displacement curve. The stress versus strain curves for three 200-300-nm-diameter Ni nanowire specimens are presented and analyzed.

Keywords

Young\´s modulus; elemental semiconductors; finite element analysis; micromechanical devices; nanoindentation; nanowires; nickel; scanning electron microscopy; silicon; stress-strain relations; tensile strength; tensile testing; 1D nanomaterials; Ni; Ni nanowire; Si; compressive nanoindentation force; experimental calibration; finite-element analysis; in situ quantitative mechanical characterization; in situ tensile testing; scanning electron microscopy; silicon microdevice; size 200 nm to 300 nm; stress versus strain curve; uniaxial tension; In situ; microdevices; nanoindenter; nanomanipulation; nanomechanics;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/JMEMS.2010.2046014

Filename

5454377