DocumentCode
1480319
Title
A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors
Author
Ahn, Youngkook ; Nam, Hyunseok ; Roh, Jeongjin
Author_Institution
Dept. of Electr. Eng., Hanyang Univ., Ansan, South Korea
Volume
27
Issue
10
fYear
2012
Firstpage
4347
Lastpage
4356
Abstract
Implementation of on-chip passive elements and efficient regulation schemes are key aspects of fully integrated dc-dc converter design. This paper presents a 50-MHz fully integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also presents full-swing and low-swing gate drivers for efficient regulation of high-frequency switching converters. The low-swing driver uses the drop voltage of a diode-connected transistor and is applied in a fabricated converter to reduce the gate driving loss caused by the high switching operation. The proposed converter is designed and fabricated using a 0.13-μm 1-poly 6-metal CMOS process. The fully integrated buck converter achieves 68.7% and 76.8 % efficiency for 3.3 V/2.0 V and 2.5 V/1.8 V conversions, respectively, while providing a load current of 250 mA.
Keywords
DC-DC power convertors; Q-factor; inductors; switching convertors; transistors; 1-poly 6-metal CMOS process; Q factors; current 250 mA; diode-connected transistor; efficient regulation scheme; frequency 50 MHz; fully integrated DC-DC converter design; fully integrated low-swing buck converter; high-frequency switching converters; lead bonding; low-swing gate drivers; on-chip passive elements; packaging inductors; size 0.13 mum; voltage 1.8 V; voltage 2.0 V; voltage 2.5 V; voltage 3.3 V; wire bonding; Bonding; Inductance; Inductors; Lead; Logic gates; Packaging; Wires; Bonding wire; fully integrated dc–dc converter; lead frame; low-swing gate driver; packaging inductor;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2012.2192136
Filename
6175983
Link To Document