• DocumentCode
    1483334
  • Title

    An analytical thermal model for MR heads

  • Author

    Guo, Yimin ; Ju, Kochan

  • Author_Institution
    Headway Technologies, Milpitas, CA, USA
  • Volume
    33
  • Issue
    5
  • fYear
    1997
  • fDate
    9/1/1997 12:00:00 AM
  • Firstpage
    2917
  • Lastpage
    2919
  • Abstract
    In this work, we present an analytical study of temperature rise due to Joule heating in magnetoresistive heads. Using a transmission-line type model and proper boundary conditions, we derived an analytical formula, including thermal resistance, finite track width and conducting lead effects. Results show the temperature rise due to Joule heat is non-uniform along the MR track width direction: the temperature rise has its peak at the center and decreases rapidly off the track. The averaged temperature rise, which is what one measures experimentally, is 20% lower than the maximum temperature rise at 2 μm track width. Although the temperature distribution also depends on thermal conductivities of both MR and lead materials, it more strongly depends on the thickness and thermal conductivity of the gap dielectric material
  • Keywords
    magnetic heads; magnetoresistive devices; temperature distribution; Joule heating; analytical thermal model; conducting lead; magnetoresistive head; temperature distribution; thermal resistance; track width; transmission line; Analytical models; Dielectric materials; Heating; Magnetic analysis; Magnetic heads; Magnetoresistance; Temperature; Thermal conductivity; Thermal resistance; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.617797
  • Filename
    617797