• DocumentCode
    148906
  • Title

    Effect of Pd thickness on bonding reliability of Pd coated copper wire

  • Author

    Jun Cao ; JunLing Fan ; Zhiqiang Liu ; YueMin Zhang

  • Author_Institution
    Sch. of Mech. & Power Eng., HeNan Polytech. Univ., Jiaozuo, China
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    623
  • Lastpage
    629
  • Abstract
    In the study, the effects of Pd thickness on free air ball, wire elongation/strength on bonding strength and bonding interface of Pd coated copper wire bonding were discussed. It was found that the Pd thickness effects on free air ball, the free air ball will become golf ball when the Pd thickness is thin excessively, then the Pd thickness is not less than 0.47% to the wire diameter, and high tensile strength and low elongation of the Pd coated copper wire will cause the second bond neck crack and irregular wedge formation for the second bond. After PCT test, voiding phenomenon happens at the bonding interface and the bonding strength also significantly reduced because little Pd doesn´t form an effective protected layer on the bonded interface, and Cu9Al4 cannot be detected anymore because of corroding by Br. In the high temperature and high humidity condition, Pd coated copper wire with more Pd thickness can form an effective protected layer and increase the bonded strength.
  • Keywords
    copper alloys; corrosion protection; cracks; elongation; lead bonding; palladium alloys; reliability; tensile strength; voids (solid); Br corrosion; PCT test; Pd coated copper wire bonding; Pd thickness effect; Pd-Cu; bonded interface; bonding interface; bonding reliability; bonding strength; free air ball; golf ball; irregular wedge formation; protected layer; second bond neck crack; tensile strength; voiding phenomenon; wire diameter; wire elongation-strength; Annealing; Bonding; Copper; Force; Morphology; Shape; Wires; IMC; Pd coated copper bonding wire; Pd thickness; strength;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826755
  • Filename
    6826755