• DocumentCode
    1490778
  • Title

    Effects of SiO2 nanofiller on the properties of epoxy resin based syntactic foam

  • Author

    Strauchs, Anja ; Mashkin, Andrey ; Schnettler, Armin

  • Author_Institution
    Inst. for High Voltage Technol., RWTH Aachen Univ., Aachen, Germany
  • Volume
    19
  • Issue
    2
  • fYear
    2012
  • fDate
    4/1/2012 12:00:00 AM
  • Firstpage
    400
  • Lastpage
    407
  • Abstract
    This paper focuses on the behavior of syntactic foam consisting of hollow glass microspheres embedded in an epoxy resin matrix. The hollow microspheres have wall thicknesses of 1 μm and a mean diameter of about 45 μm. Inserting microspheres in pure epoxy resin results in an increased viscosity of the liquid material during manufacturing process. In order to counteract this effect, SiO2 nanofillers are mixed to the liquid, uncured epoxy resin during the manufacturing process before the hollow microspheres are added. Viscosity measurements verify a significant reduction of the mixing viscosity up to 64 % by adding a small weight percentage (<; 5 wt.%) of nanofillers. Furthermore, the impact of the SiO2 nanofiller on the electrical, mechanical and thermal properties of syntactic foam is determined and discussed.
  • Keywords
    association; electrical conductivity; filled polymers; glass; impact strength; mixing; nanocomposites; nanofabrication; polymer foams; reduction (chemical); resins; silicon compounds; thermal stability; viscosity; SiO2; electrical conductivity; electrical properties; epoxy resin matrix; hollow glass microspheres; impact strength; insertion reactions; liquid material; manufacturing process; mechanical properties; mixing; nanofiller effects; reduction; size 1 mum; syntactic foam; thermal properties; thermal stability; viscosity; Epoxy resins; Filling; Stress; Syntactics; Viscosity; Syntactic foam; composite insulation; electrical insulation properties; epoxy resin; hollow microspheres; nanofiller;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2012.6180231
  • Filename
    6180231