DocumentCode
1491875
Title
5th Topical Meeting On Electrical Performance Of Electronic Packaging
Volume
20
Issue
3
fYear
1997
Abstract
Presents the front cover of the proceedings record.
Keywords
Application specific integrated circuits; Ceramics; Electronics packaging; Flip chip; Noise measurement; Nonhomogeneous media; Power distribution; Semiconductor device measurement; Semiconductor device modeling;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/TCPMB.1997.618214
Filename
618214
Link To Document