• DocumentCode
    1493128
  • Title

    Modeling of Stress-Retarded Thermal Oxidation of Nonplanar Silicon Structures for Realization of Nanoscale Devices

  • Author

    Ma, Fa-Jun ; Rustagi, Subhash C. ; Samudra, Ganesh S. ; Zhao, Hui ; Singh, Navab ; Lo, Guo-Qiang ; Kwong, Dim-Lee

  • Author_Institution
    Inst. of Microelectron., Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore
  • Volume
    31
  • Issue
    7
  • fYear
    2010
  • fDate
    7/1/2010 12:00:00 AM
  • Firstpage
    719
  • Lastpage
    721
  • Abstract
    Accurate modeling of stress-retarded orientation-dependent 2-D oxidation is carried out by matching the experimental and simulated oxide thicknesses of silicon FIN nanostructures over a wide range of temperatures and times in dry oxygen. Experimentally observed initial oxidation rate enhancement, orientation-dependent stress retardation, and self-limiting phenomena are modeled, and a new universal stress retardation parameter set is obtained for the first time. The new parameter set has been validated against oxidation experiments presented here and those reported in the literature. Furthermore, the new model is used to explore silicon nanowire shape engineering.
  • Keywords
    nanoelectronics; nanowires; oxidation; dry oxygen; nanoscale device; nonplanar silicon structure; orientation-dependent stress retardation; oxidation rate enhancement; oxide thickness; self-limiting phenomena; silicon FIN nanostructure; silicon nanowire shape engineering; stress-retarded orientation-dependent 2D oxidation; stress-retarded thermal oxidation; universal stress retardation parameter set; 2-D oxidation; Nanowire (NW); orientation dependence; self-limiting; shape engineering; stress retardation;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2010.2047375
  • Filename
    5466093